TSPT+ 3300V 1800A HiPak

Product of ABB

InnoTrans 2020 InnoTrans 2018

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CH-5300 Turgi

InnoTrans 2020 InnoTrans 2018
  • Railway Technology Railway Technology

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Product description

With the TSPT+ technology ABB has combined the merits of the Enhanced Planar cell with Trench technology and created the TSPT+ 3300V 1800A HiPak. The new TSPT+ represents the latest generation IGBT cell technology, enabling a further loss reduction and hence the possibility to increase the current density.

The TSPT+ 3300V 1800A HiPak allows an increase in rated current of 20 percent compared to the previous 1500A generation in the same HiPak2 housing. In addition it is designed to cope with increased stray inductance values